The Global Vertical Probe Cards Market 2022 Research Report is a professional and in-depth study on the current state of the industry. It provides key statistics on the market status of the global Vertical Probe Cards manufacturers and is a valuable source of guidance and direction for companies. The report also provides valuable insights into the impact of the COVID-19 regulations on the market.
LSI chip inspection
The vertical probe card includes an elliptical printed
substrate with a vertical needle in FIGS. 12 and 13. The upper guide plate 5
has a slot for the probe needle, and each of the lands is connected with a flat
or coaxial cable. The slot is centered at the top of the card, and the needle
is electrically connected to the printed substrate by a wire 10 and a patterned
cable 13.
A conductive coupling trace is positioned to generate a
variable magnetic field based on the signal from the communication control chip.
The size and number of windings determine the sensitivity of the signal. Small
winding pitches and high number of windings require a fine processing
technique, which increases the cost of the probe card.
Probe card technology
IC manufacturers are incorporating more advanced chip
packaging technologies to reduce costs and enhance performance. These newer
technologies include 2.5D and 3D ICs. Despite being in the early stages of
development, these advanced technologies promise better chip connectivity and lower
power consumption. These technologies are expected to increase the demand for
semiconductor products. In addition, the growing adoption of smart wearable
devices is likely to fuel the demand for probe cards.
The main components of a vertical probe card are the probe,
guide plate, space transformer, and PCB. Each of these components has different
functions and must meet certain specifications. If you're unsure of which
component you need, contact a JEM sales representative.
Guide plate technology
Guide plate technology for vertical probe cards is a new
development in the field of optical metrology. The guide plate is made of two
pieces: an upper and lower one. The upper one is made of mica-based ceramics,
which offer superior processability and enable the probe needle to be
positioned within the center of the hole regardless of temperature. The two
pieces also allow for a 4x4 or 4x8 structure, which can be produced
economically.
The upper guide plate is a circularly shaped part, and the
lower guide plate is shaped similarly. The lower guide plate includes a hole 6a
to guide the probe needle. The lower guide plate is made of silicon compound.
The number of holes 6a is the same as the number of pads and probe needles, and
the holes are formed by ultrasonic processing.
Ceramic blade technology
Using ceramic blade technology on vertical probe cards provides a variety of benefits over standard blade probe
cards. The blades have a high level of mechanical stability, can support high
voltage and current input, and have low leakage measurements. The use of
ceramic blades allows for shorter probe lengths and is particularly
advantageous for matched impedance applications.
Ceramic blades are also customizable and can be designed for
specific applications and operating environments. They come in many shapes and
sizes, and their thickness, width, and depth influence performance and
stability. In addition, the blades can be made with either flat or pointed
tips.
Cantilever probe technology
High-speed, low-force cantilever probe technology is an
advancement over conventional, linear probe cards. With an increased pin
density and higher bandwidth, cantilever probe cards can test more devices in
parallel. In addition, their lithographically defined springs reduce contact
force by an order of magnitude compared to conventional probes.
The technology is used for testing mixed-signal, logic, and
memory ICs. It is also being used for 3D chip stacking and as an intermediate
board for the assembly of probe cards. The advancement of MEMS technology
enables higher-density substrates and fine-pitch probes for cantilever probes.